Xiaomi is not idle. Work on the XRING O2 chipset is intensive, it could also make its way into cars or watches XRING O2 trademark appeared in Chinese database The new chipset was reportedly successfully completed already in March US restrictions could reportedly complicate the deployment of 2nm manufacturing technology Sdílejte: Adam Kurfürst Publikováno: 30. 6. 2025 12:00 The Chinese technology giant Xiaomi is likely not idle and is already preparing the successor to its first proprietary chipset. A mention of the **XRING O2 chipset** has reportedly appeared on the Chinese trademark registration platform TianYanCha, which is expected to follow up on the recently introduced **XRING O1**. This currently powers the flagship smartphone **Xiaomi 15S Pro** and the powerful tablet Xiaomi Pad 7S Pro, and has managed to surpass competing solutions like Qualcomm’s **Snapdragon 8 Elite** or **MediaTek Dimensity 9400** in benchmarks. Ambitious plans with the latest technology As reported by TrendForce, according to leaks cited by EE Times China, the XRING O2 was successfully completed (tape-out) already **in March this year**. While the current XRING O1 is manufactured using TSMC’s second-generation 3nm manufacturing process (N3B), its successor could benefit from even more advanced technologies. The new chipset is expected to utilize at least **TSMC’s third-generation 3nm technology** (N3P), or even the more ambitious **2nm technology**. Xiaomi Pad 7S Pro s čipem XRING O1 However, Xiaomi’s plans may be complicated by **US trade restrictions**. Due to restrictions on specialized tools necessary for designing modern chips, the Chinese company may not be able to utilize the most advanced 2nm process. In such a case, it would have to settle for the **TSMC N3E process**, which could mean that the XRING O2 will lag behind the expected **Qualcomm Snapdragon 8 Elite Gen 3** and **Apple A20** in performance, as these are expected to benefit from the 2nm technology. Persistent challenges and innovative approach Despite progress in developing its own chipsets, Xiaomi still has one major weakness – the **need to rely on an external chip** for mobile connectivity. The company is expected to continue using solutions from MediaTek, likely with an upgrade from the **T800 modem to the newer T900**. This dependence on an external supplier represents a certain disadvantage compared to integrated solutions from competitors. Xiaomi is not idle. Work on the XRING O2 chipset is intensive, it could also make its way into cars or watches Adam Kurfürst Zprávičky Adam Kurfürst Zprávičky An interesting piece of information was then provided by the well-known leaker **Digital Chat Station**, according to whom Xiaomi could develop a single universal chip design that would subsequently be **adapted for various product categories**. Modified versions of the same architecture could thus power not only smartphones but also **smartwatches or automotive systems**. When can we expect the first devices? The exact timeline for the launch of the **XRING O2** chipset or the products that might be equipped with it is not yet known. Given that the XRING O1 was only recently introduced with the **Xiaomi 15S Pro**, it can be assumed that we will have to wait some time for its successor. However, it is clear that **Xiaomi has serious ambitions** to become a significant player in the field of designing its own chipsets, similar to Apple, Samsung, or Huawei. How much are you looking forward to the further development of Xiaomi’s own chipsets? Sources: TrendForce, Gizmochina, Digital Chat Station/Weibo Über den Autor Adam Kurfürst Adam studuje na gymnáziu a technologické žurnalistice se věnuje od svých 14 let. Pakliže pomineme jeho vášeň pro chytré telefony, tablety a příslušenství, rád se… Mehr über den Autor Sdílejte: Čína čipset procesor Xiaomi Xring O1